Extended Submission Deadline:
June 1, 2017
Notification of Acceptance:
10-14 days after submission
Regular Registration Deadline:
June 23, 2017
Valued colleagues and guests,
Welcome to Osaka, Japan!
We are delighted to have you among us for the International Symposium on Engineering and Applied Science, 2017, organized by the Higher Education Forum. That many of you have decided to travel long distances to attend serves to remind us all just how important our work as scholars, researchers, and human resources specialists really is. We are honoured to share this event with you.
Osaka is a bustling, modern city that offers many attractive sights, as well as easy access to the old charm and historical attractions of beautiful Kyoto, and to dynamic Kobe. From stunning Osaka Castle to the never-ending nightlife of Namba and culinary delights of Umeda, Osaka will surely make your visit to Japan an unforgettable experience. Go out there and explore! Osaka and its outgoing, beautiful people are waiting for you.
We sincerely hope that you will enjoy your stay, and that this chance to network, learn, and grow as professionals will be truly unique and productive. We have no doubt that this opportunity will bring together local and international talented professionals, eager to discuss new developments, challenges, and projects that will open new possibilities in our fields of work and research. Together, we have the power to make of this a positive and constructive event, upon which we can continue to build better and more productive environments.
Looking forward to working and learning together during ISEAS 2017!